注：你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的指南。
正翻译步骤 12
步骤 12
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Roll the thermal putty into a ball.
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Place the thermal putty where the damaged thermal pad was, making sure it's centered over the component—in this case a memory chip.
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Optionally, you can use the flat end of a spudger (or an included applicator) to spread the thermal putty over the surface of the component.
| + | [* black] Roll the thermal putty into a ball. |
|---|---|
| + | [* black] Place the thermal putty where the damaged thermal pad was, making sure it's centered over the component—in this case a memory chip. |
| + | [* black] Optionally, you can use the flat end of a spudger (or an included applicator) to spread the thermal putty over the surface of the component. |
| + | [* icon_note] When you reattach the heat sink, you'll compress the thermal putty and it'll spread the ball out. |
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